2006.06.15豁免清单
Scope of the RoHS Directive (Exemptions)
On 1 July 2006 the RoHS Directive (2002/95/EC) becomes enforceable. This Directive bans the putting on the EU market of new electrical and electronic equipment (EEE) containing more than 0.1% lead, mercury, hexavalent chromium, PBB and PBDE and 0.01% Cadmium. The RoHS Directive covers nearly all kind of EEE “designed for the use with a voltage not exceeding 1000 volts for alternating current and 1500 volts for direct current”. Medical devices as well as monitoring and control instruments are not covered by the scope of the RoHS Directive. Also the Directive does not apply to spare parts for the repair or to the reuse, of EEE put on the market before 1 July 2006. Further exemptions are only possible due to technical reasons. Until now some exemptions are made as listed below.
Exemptions in force:
1 Mercury in compact fluorescent lamps not exceeding 5 mg per lamp.
2 Mercury in straight fluorescent lamps for general purposes not exceeding.
__halophosphate 10 mg
__triphosphate with normal lifetime 5 mg
__triphosphate with long lifetime 8 mg
3 Mercury in straight fluorescent lamps for special purposes.
4 Mercury in other lamps not specifically mentioned in this Annex.
5 Lead in glass of cathode ray tubes, electronic components and fluorescent tub
6 Lead as an alloying element in steel containing up to 0,35% lead by weight,
aluminium containing up to 0,4% lead by weight
and as a copper alloy containing up to 4% lead by weight.
7 (2005/747/EG) — Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead),
— lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching,
signalling, transmission as well as network management for telecommunications,
— lead in electronic ceramic parts (e.g. piezoelectronic devices).
8 (2005/747/EG) Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC (*) amending Directive 76/769/EEC (**) relating to restrictions on the marketing and use of certain dangerous substances and preparations.
9 Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators.
9a (2005/717/EG) DecaBDE in polymeric applications
9b (2005/717/EG) Lead in lead-bronze bearing shells and bushes
11 (2005/747/EG) Lead used in compliant pin connector systems.
12 (2005/747/EG) Lead as a coating material for the thermal conduction module c-ring.
13 (2005/747/EG) Lead and cadmium in optical and filter glass.
14 (2005/747/EG) Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80 % and less than 85 % by weight.
15 (2005/747/EG) Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.’
16 (2006/310/EC) Lead in linear incandescent lamps with silicate coated tubes
17 (2006/310/EC) Lead halide as radiant agent in High Intensity Discharge (HID) lamps used for professional reprography applications
18 (2006/310/EC) Lead as activator in the fluorescent powder (1% lead by weight or less) of discharge lamps when used as sun tanning lamps containing phosphorus such as BSP (BaSi2O5
b) as well as when used as speciality lamps for diazo-printing reprography, lithography, insect traps, photochemical and curing processes containing phosphorus such as SMS ((Sr,Ba)2MgSi2O7
b)
19 (2006/310/EC) Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact Energy Saving Lamps (ESL)
20 (2006/310/EC) Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used for Liquid Crystal Displays (LCD)
Exemptions under discussion
There are still exemptions which are not decided yet. Stakeholders were asked to give comments on the listed exemptions from the consultation documents. Most of the proposed exemptions are dealing with lead.
Exemptions dealing with Lead:
• Lead in tin whisker resistant coatings for fine pitch applications,
• Lead bound in glass, crystal glass, lead crystal or full lead crystal in general,
• Lead in lead oxide glass plasma display panels,
• Lead in connectors, flexible printed circuits, flexible flat cables,
• Lead oxide in lead glass, bonding materials of magnetic heads and magnetic heads
• Lead in optical isolators,
• Lead in sheath heater of Microwaves,
• Solders containing lead and/or cadmium for specific applications,
• Special purposes Black Light Blue (BLB) lamps, containing lead in the glass envelope,
• Low melting point alloys containing lead,
• Galvanised steel containing up to 0.35% lead by weight and aluminium with an unintended lead content up to 0.4% lead by weight in electrical and electronic equipment
• Lead in solder and hexavalent chromium in surface treatment, in parts recovered from production printers and copying equipment, sold, rented or leased or otherwise returned from professional users other than private households, originally put on the market before 1 July 2006, and reused for the same purpose within the original manufacturer's closed loop system until 1 July 2011. In this context a closed loop system means a system whereby the equipment remains the property of the manufacturer or is subject to other contractual arrangements and is returned to the manufacturer either when the contract expires or at end of life,
• Special ICs having tin-lead solder plating on leads used in professional equipment;
• Solders containing lead and /or cadmium for specific applications where local temperature is higher than 150 deg C and which need to work properly more than 500 hours
• Lead in solder for printed circuit boards for emergency lighting products
• Specific modular units including tin-lead solder being used in special professional equipment;
• Lead in gas sensors
• Concerning of PbO (Lead in Seal Frit) used for making BLU (Back Light Unit) Lam;
• Lead alloys as electrical/mechanical solder for transducers used in high-powered professional and commercial loudspeakers
• Solder tin of the thermo fuse with a defined low melting point
• Lead in lead oxide glass used in plasma display panel (PDP)
• Lead in solder on small PCB and tinned legs of primary components
• Use of the not lead free component NEC V25 in the Memor 2000
• Lead used in shielding of radiation for Non Medical X-ray equipment
• Lead based solders sealed or captured within heat-shrinkable components and devices
• The use of lead in solder applications for electronic components of musical instruments having an average lifespan in excess of 10 years
• Lead solder alloy in Surge protective devices (SPDs)
• Inventory of Special ICs having tin-lead solder on/in leads/balls, used in specialist/professional equipment
• Lead alloys as electrical/mechanical solder for transducers used in high-powered professional and commercial loudspeakers
• Solder containing lead for applications where the local temperature exceeds 150 C and reliable operation for a minimum of 30,000 hours is required
• Tin-lead solder in the manufacture of professional audio equipment
• Specific modular units including tin-lead solder being used in special professional equipment
• Lead in electronic vacuum tubes
• Lead in aluminum used in gas valves for domestic cooking appliances
• Lead in solder of parts recovered from gaming/amusement machines put on the market before 1/07/06 and reused for the same purpose within a manufacturer’s closed loop until July 2014
• Lead in solders in components and assemblies used in non-consumer products, provided that: - such components and assemblies were purchased or are subject to a proven last-time buy contract placed before 1 July, 2006; and - such components and assemblies are used in models of EEE that were already available on the market before 1 July 2006
Exemptions dealing with Chromium:
• Chromium (also in oxidation state (VI)) and Cadmium as coloring batch addition each form up to a content of 2 % in glass, crystal glass, lead crystal or full lead crystal used as decorative and / or functional part of electric or electronic equipment,
• Hexavalent chromium (CRVI) passivation coatings,
• Hexavalent chromium (Cr-VI) in chromate conversion coatings as surface treatment;
Exemptions dealing with Cadmium:
• Cadmium as doping material in avalanche photodiodes (APDs) for the optical fiber communication systems,
• Cadmium pigments except for applications banned under Directive 91/338/EEC amending Directive 76/769/EEC relating to the restriction on the marketing and use of certain substances,
• Cadmium in opto-electronic components
• Cadmium-bearing copper alloys
• Cadmium oxide
Exemptions dealing with Mercury:
• Mercury free flat panel lamp,
• Mercury in switches
Other Exemptions:
• Non-consumer mechanical power transmission systems including speed reducers and mechanical couplings which rely on electrical/electronic components for safe control and operation
• Electrical and electronic components contained in heating ventilating and air conditioning building systems, commercial refrigeration systems and transport refrigeration systems;
• Electrical/electronic components contained mobile and stationary air compressors and vacuum systems, compressed air contaminant removal systems and pneumatic contractor’s air tools
• Electrical/electronic equipment that are: used in transport -aviation, aerospace, road, maritime, rail; installed in to the fabric of buildings – elevators, escalators, moving walks, dumb waiters, and heating, cooling and ventilation systems, and fire and security systems; used in the energy generation and transmission; used in mining and mineral processing; used for non-consumer mechanical power transmission systems; industrial process pumps and compressors; used in industrial refrigeration; and used in military applications
• On-Semi MCR265-10 SCR
• Components NEC V55
Exemptions from the 5th stakeholders consultation:
1. Cadmium and cadmium oxide in thick film pastes used on beryllium oxide substrates until January 1, 2008;
2. Gaskets of butyl rubber material vulcanised with chinondioxim and lead tetraoxide, for use in Aluminium Electrolytic Capacitors;
3. Sharp LQ104X2LX11 (formerly Fujitsu FLC26XGC6R-01);
4. Quartz Crystal Resonator and in Fine Pitch Electronics Systems used in the Swiss Watch Industry;
5. Cadmium in opto- electronic components;
6. Transducers used in professional loudspeaker systems, using tin-lead solder;
7. Tin-lead solder in the manufacture of professional audio equipment;
8. Components used in the manufacture of the Hog1000, Hog500, Event416, Event408, ESP2-24 and ESP2-48 lighting control consoles;
9. Specific modular units, including tin-lead solder, being used in special professional equipment;
10. Inventory of special ICS having tin-lead solder on/in leads/balls, used in specialist/professional equipment;
11. Cadmium Mercury Telluride;
12. Lead contained in Babbit lined bearings;
13. Cadmium alloys as electrical/mechanical solder joints to electrical conductors located directly on the voice coil in transducers used in high-powered loudspeakers;
14. Thermal cutoff with a fusible element that contains lead (and possibly cadmium, mercury and hexavalent chromium) for applications where normal operating temperature exceeds 140 C and reliable, predictable, operation for a minimum of 30,000 hours is required;
15. Mercury free flat panel lamp;
16. Electronic equipment where the reliability, durability and longevity of the equipment is paramount;
17. Semi Red Brass C84400, 81-3-7-9 or a similar Brass material. Used on radio frequency line sections;
18. Lead is used as an alloy to the copper in 6 to 8 % by weight. Needed for casting and machinability characteristics;
19. Lead in solders for electronic equipments used for the monitoring, the protection and the safety of people in healthcare, telecare and emergency calls domains in professional and private sectors;
20. FPGA devices manufactured by Xilinx (XC5202-6VQ100C, XC4003E-3VQ100C and XC4013E-3PQ240C) containing lead solder (Pb) used in the plating of the device terminations;
21. Lead oxide in seal frit used for making window assemblies for argon and krypton laser tubes;
22. Smart card readers (product: GemSelf700-MS2, GCR700-3ZS, Vodafone D2 , GCR760 and GemSelf750 SV);
23. Use of mercury in Babcock’s DC plasma displays and use of Lead Oxide (PbO) in Babcock’s DC plasma displays frit seal.
