RoHS指令豁免项目【Exempted Items of RoHS Directive】总结
文章摘自：[url]http://194965.dl-z.com/Affiche.html[/url]欧盟委员会针对豁免材料陆续发布了8 次决议，分别是：2002/95/EC、2005/717/EC、2005/747/EC、2006/310/EC、2006/690/EC、2006/691/EC、2006/692/EC和2008/385/EC，这些决议中的豁免共计32 项：
1.小型荧光灯中的汞，汞含量不超过5mg/灯。【Mercury in compact fluorescent lamps not exceeding 5 mg per lamp.】
2.
普通用途直荧光灯中的汞，汞含量不超过：
Mercury instraight fluorescent lamps for general purposes notexceeding:
·盐磷酸盐10mg.
Halophosphate 10mg;
·普通寿命的三磷酸盐5mg
Triphosphate withnormal lifetime 5 mg;
·长寿命的三磷酸盐8mg
Triphosphate withlong lifetime 8 mg.
3.特殊用途直荧光灯中的汞
Mercury instraight fluorescent lamps for special purposes.
4本附录未明确提出的其他灯具中的汞
Mercury in otherlamps not specifically mentioned in this Annex.
5阴极射线管，电子元件以及荧光管的玻璃中的铅
Lead in glass ofcathode ray tubes, electronic components and fluorescenttubes.
6铅作为合金元素在：
Lead as analloying element in:
·钢合金，铅的重量含量不超过0.35 %
Steel containingup to 0.35 % lead by weight;
·铝合金，铅的重量含量不超过0.4%
Aluminiumcontaining up to 0.4 % lead by weight;
·铜合金，铅的重量含量不超过4%
Copper alloycontaining up to 4 % lead by weight.
7·用于高温融化焊料中的铅（即：锡铅焊料合金中铅含量超过85%）
Lead in highmelting temperature type solders (i.e. lead-based alloys containing85 % by weight or more lead).
·用于服务器，存储器和存储系统中的铅，用于交换，信号和传输，以及电信网络管理的网络基础设施设备中焊料中的铅。
Lead in soldersfor servers, storage and storage array systems, networkinfrastructure equipment for switching, signalling, transmission aswell as network management for telecommunication.
·电子陶瓷产品中的铅（如：高压电子装置）
Lead inelectronic ceramic parts (e.g. piezoelectronicdevices).
8.
根据修改关于限制特定危险物质和与制品销售和使用的第76/796/EEC号指令的91/338/EEC号指令禁止以外的镉电镀。
Cadmium and itscompounds in electrical contacts and cadmium plating except forapplications banned under Directive 91/338/EEC amending Directive76/769/EEC relating to restrictions on the marketing and use ofcertain dangerous substances and preparations.
9.在吸收式电冰箱中作为碳钢冷却系统防腐剂的六价铬。
Hexavalentchromium as an anti-corrosion of the carbon steel cooling system inabsorption refrigerators.
10.用于铅铜合金轴承和衬套中的铅。
Lead inlead-bronze bearing shells and bushes.
11.
顺应针连接器系统中的铅。
Lead used incompliant pin connector systems.
12.
用于热传导模块C-环的被覆材料中的铅。
Lead as a coatingmaterial for the thermal conduction modulec-ring.
13.
用于光学及滤波器玻璃中的铅和镉。
Lead and cadmiumin optical and filter glass.
14.
微处理器针脚及封装联接所使用的含两种以上组分的焊料中的铅（铅含量在80%与85%之间）。
Lead in soldersconsisting of more than two elements for theconnection
between the pinsand the package of microprocessors with a lead content of more than80% and less than 85% by weight.
15.
集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。
Lead in soldersto complete a viable electrical connection between semiconductordie and carrier within integrated circuit Flip Chippackages.
16.用于带有硅酸盐灯管的线型白炽灯中的铅。
Lead in linearincandescent lamps with silicate coated tubes.
17.用在专业复印领域高强度放电灯(HID)做激发介质中的卤素铅。
Lead halide asradiant agent in High Intensity Discharge (HID) lamps used forprofessional reprography applications.
18.放电管的荧光粉中作为催化剂的铅（铅的重量小于等于1%）可以豁免，当放电管用于含有磷元素（如BSP (BaSi2O5b)）的日晒灯时，以及用于重氮印刷、平板印刷、捕虫、光化学、固化工艺等等专业领域的灯具时。
Lead as activatorin the fluorescent powder (1 % lead by weight or less) of dischargelamps when used as sun tanning lamps containing phosphors such asBSP (BaSi2O5b) as well as when used as speciality lamps for diazo-printing reprography, lithography, insect traps, photochemical and curing processes containing phosphors such as SMS ((Sr,Ba)2MgSi2O7b).
[[i] 本帖最后由 xiaowei 于 2008-9-10 19:35 编辑 [/i]] 不知道现在有没有增加其他的 希望更贴 好东西,不知还有没有其它更新的.. 不是说有34项吗？看来还是要自已考虑总结呀
页:
[1]
